Environmentally friendly technologies
zone
[Recruitment Targets] Precious metal plating/recycling/cleaning/waste liquid and wastewater treatment/pre-treatment of plating and resins/resin modification/reduction of defective products and yield, etc.
View the application guidelines
Surface modification
Dry process zone
[Recruiting] DLC coating / PVD/CVD / Plasma treatment / Shot peening / Laser processing / Thermal spraying/Heat treatment / Blast processing / Testing and measuring equipment, etc.
View the application guidelinesElectronic components and semiconductors
Pavilion
[Target Areas of Application] Copper plating, gold plating, precious metal plating / Vacuum deposition, sputtering, ion plating / CVD / Etching / Oxidation and nitriding / Ion implantation / Annealing / CMP (Chemical Mechanical Polishing) / Photolithography / Passivation / Solder resist / Silicide formation, etc.
View the application guidelinesRegistration will close once the maximum number of participants is reached. Please contact the secretariat for details.
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The Surface Finishing Society of Japan
The Japan Suppliers Association of Plating Materials
SURTECH Executive Committee
JTB Communication Design, Inc
Celestine Shiba Mitsui Building,3-23-1 Shiba, Minato-ku, Tokyo 105-8335
TEL:+81-3-5657-0850
Email: surtech@jtbcom.co.jp
[Contact Information]SURTECH Executive Committee Secretariat (JTB Communication Design, Inc.) |
